消除温度对倒装键合对准精度影响的方法  

Method for Eliminating the Influence of Temperature on the Alignment Precision in Flip-Chip Bonding

作　　者：张丽娜[1] 韩雷[1] 

机构地区：[1]中南大学现代复杂装备设计与极端制造教育部重点实验室,长沙410083

出　　处：《半导体技术》2008年第11期947-951,共5页Semiconductor Technology

基　　金：国家自然科学基金(50575230;50675227);国家重点基础研究发展计划(973)项目(2003CB716202);湖南省自然科学基金面上项目(07JJ3091)

摘　　要：为消除温度在热超声倒装键合过程中芯片与基板对准精度的影响,必须将因键合加热而引起的图像抖动量控制在亚像素范围内。设计了一套实验方案,通过实验对比,发现在未启用吹气装置时图像间的抖动剧烈,明显受温度影响,不能满足对准精度要求。采用二元二次曲面拟合亚像素法计算了启用吹气装置后图像间的平移,发现图像间整像素级的抖动明显消除,亚像素级的抖动受温度影响小,在键合温度下最大抖动量不超过0.3像素,能满足对准精度要求。该方法为热超声倒装工艺提出了有价值的参考。To eliminate the influence of temperature on the alignment precision of chips and substrates in the process of thermosonic flip-chip bonding, the image dithering caused by heating must be controlled in subpixel scope. A set of experiments was designed by contrasting two sets of experiments. It was found that the image dithering intensely and significantly affected by temperature when without the pneumatic device, so can not meet the requirement of precision alignment. The sub-pixel method based on binary quadratic curved surface fitting was adapted to computing the translation between images after using the pneumatic device. Found the integral pixel image dithering was disappeared and the influence of temperature on sub-pixel image dithering became small. The largest dithering at the working temperature is less than 0.3 pixel, which can meet the requirement of precision alignment. This method proposed a valuable reference for the technology of thermosonic flip-chip bonding.

关 键 词：热超声倒装键合 图像抖动 相关函数 亚像素 曲面拟合 

分 类 号：TP391.41[自动化与计算机技术—计算机应用技术] TN305.94[自动化与计算机技术—计算机科学与技术]