CuNiSiP合金的动态再结晶行为  

Dynamic Recrystallization Behavior of CuNiSiP Alloy

作　　者：李银华[1] 刘平[1,2] 贾淑果[1] 张毅[3] 田保红[1] 任凤章[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]上海理工大学机械工程学院,上海200093 [3]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《机械工程材料》2008年第11期82-85,共4页Materials For Mechanical Engineering

基　　金：国家863计划资助项目(2006AA03Z528);国家自然科学基金资助项目(50571035);河南省杰出青年基金资助项目(0521001200)

摘　　要：在Gleeble-1500D热模拟试验机上对CuNiSiP合金在高温压缩变形中的流变应力和组织变化进行了研究,分析了其再结晶行为。结果表明:应变速率和变形温度对合金的再结晶影响较大,在0.1,0.01 s-1应变速率下,650℃以上即可发生再结晶,而在1,5 s-1应变速率下,700℃以上才能发生再结晶;变形温度越高、应变速率越小,合金越容易发生再结晶;利用Arrhenius双曲正弦函数求得CuNiSiP合金的热变形激活能Q为485.6 kJ.mol-1。The flow stress behavior and microstructure change of CuNiSiP alloy during hot compression deformation process were studied by isothermal compression test on Gleeble-1500D thermal-mechanical simulator. The results show that both strain rate and deforming temperature had great effect on the dynamic recrystallization of the alloy. When the strain rates were 0. 1 and 0. 01 s^-1 , recrystallization could happened when the temperature was higher than 650℃. However, when the strain rates were 1 and 5 s^-1 , the recrystallization could happened only when the temperature was higher than 700℃. The higher the temperature, and the smaller the strain rate, the easier the dynamic recrystallization. The hot deformation activation energy of the CuNiSiP alloy was gained by Arrhenius hyperbolic sine function to be Q=485. 6 kJ ·mol^-1.

关 键 词：CuNiSiP合金 热压缩变形 动态再结晶 热模拟 

分 类 号：TG146.1[一般工业技术—材料科学与工程] TG113.2[金属学及工艺—金属材料]