环孔工艺的碲镉汞长波红外576×6焦平面探测器组件  

HgCdTe LWIR 576×6 FPA PREPARED BY LOOPHOLE TECHNIQUE

作　　者：姚英[1] 庄继胜[1] 邹继鑫 姬荣斌[1] 朱颖峰[1] 陈晓屏[1] 范宏波[1] 蔡毅[1] 

机构地区：[1]昆明物理研究所,云南昆明650223 [2]华东光电集成器件研究所,安徽蚌埠233042

出　　处：《红外与毫米波学报》2008年第6期417-420,共4页Journal of Infrared and Millimeter Waves

摘　　要：碲镉汞长波红外576×6焦平面探测器组件是高性能热像仪的核心组件.本文中作者完成了碲镉汞长波红外576×6焦平面探测器组件的设计,利用环孔技术制备出576×6焦平面探测器芯片,经过杜瓦封装、配斯特林制冷机后成为实用的探测器组件.性能参数测试表明:典型的探测率达到1.79×1011cm Hz1/2/W,非均匀性达到14.6%,盲元率达到6.0%,并完成探测器组件的实验室演示成像.HgCdTe long wave infrared（LWIR） 576 x 6 focal plane assembly （FPA） is a core assembly of high performance thermal imager. In this study, the design of HgCdTe LWIR 576× 6 FPA was completed, and the 576 × 6 focal plane arrays were prepared with loophole technology. The integrative 576×6 FPA was obtained by packaged in Dewar/Stirling Cooler assembly. Parameters measurements show ^11 that the typical detector average peak detectability is 1.79 × 10n cm Hz^1/2/W, the uniformity is 14.6%, and the died detective element is 6.0%. The thermal imaging of the 576× 6 FPA has also been demonstrated in the laboratory.

关 键 词：环孔技术 碲镉汞 长波红外 576×6焦平面探测器组件 

分 类 号：TN215[电子电信—物理电子学]