超声椭圆振动化学机械抛光原理与实验系统  

Chemical-Mechanical Polishing Principle and Experimental System of Ultrasonic Elliptic Vibration

作　　者：杨卫平[1,2] 徐家文[1] 吴勇波 

机构地区：[1]南京航空航天大学机电学院,南京210016 [2]江西农业大学工学院,南昌330045 [3]日本秋田县立大学机械智能系统工程系,秋田015-0055

出　　处：《南京航空航天大学学报》2008年第6期753-757,共5页Journal of Nanjing University of Aeronautics & Astronautics

摘　　要：介绍了抛光工具超声椭圆振动产生的基本原理,并实际测试了抛光工具的椭圆运动特性。从理论上分析了在抛光工具上加入超声椭圆振动后,对改善和提高抛光效果的作用机理。在上述研究工作基础上,建立了超声椭圆振动辅助抛光实验系统并进行了实验研究。结果表明,该超声椭圆振动辅助抛光法对硅片抛光表面质量、材料去除率均有较显著的改善。The principle of the ultrasonic elliptic vibration produced by polishing tool is introduced and elliptic motion characteristics of the polishing tool are tested. Then the working mechanism of ultrasonic elliptic vibration for improving the polishing quality is analyzed. Finally, based on the above established testing system of ultrasonic elliptic vibration assisted polishing, experimental investigations are conducted. Experimental results show that the silicon wafer polishing with the new method on surface quality, and material remove rate are better than that of without polishing.

关 键 词：超声 椭圆振动 化学机械抛光 复合抛光 

分 类 号：TH16[机械工程—机械制造及自动化]