高比例SiC_p/Al复合材料的有效热导率模型  

Effective Thermal Conductivity Model of High Volume SiC_p/Al Composite

作　　者：周贤良[1] 邹爱华[1] 华小珍[1] 张建云[1] 饶有海[1] 

机构地区：[1]南昌航空大学材料科学与工程学院,南昌330063

出　　处：《材料导报》2009年第2期67-69,共3页Materials Reports

基　　金：国家科技基础条件平台建设项目(2005DKA10400-Z8);航空科学基金(2007ZF56016)

摘　　要：有效热导率是铝基复合材料在电子封装、热控方面应用的重要性能指标。结合复合材料广义自洽微观力学模型,并在Maxwell理论的基础上,初步建立了适合高体积分数SiCp/Al复合材料的有效热导率预测模型。模型不仅考虑了颗粒与颗粒、颗粒与基体间的界面效应,而且在一定程度上也考虑了增强体颗粒的形状。其理论计算结果与实测值吻合较好。The effective thermal conductivity is a very important property index of aluminum matrix composite for electronic packing and heat control applications. Based on the Maxwell theory and the generalized self-eonsistent scheme micromechanics models, the theoretical model for predicting the effective thermal conductivity of high volume fraction SiCp/A1 eomposites is constructed, in which the interfacial effeets between SiC particles and particles A1 ma- trix are considered, and the shapes of particles are also considered in a degree. The calculations of the model are close to the experiment results.

关 键 词：SICP/AL复合材料 界面效应 有效热导率 模型 

分 类 号：TB331[一般工业技术—材料科学与工程]