电子封装材料用金刚石/铜复合材料的研究进展  

Research Progress of Diamond-Cu Composite Material for Electronic Packaging

作　　者：尚青亮[1] 陶静梅[1] 徐孟春[1] 李才巨[1] 朱心昆[1] 

机构地区：[1]昆明理工大学,云南昆明650093

出　　处：《电子工艺技术》2009年第1期5-8,共4页Electronics Process Technology

摘　　要：电子技术的快速发展对封装材料的性能提出了更严格的要求。针对封装材料的发展趋势,金刚石/铜复合材料作为新一代的电子封装材料受到了广泛的重视,概述了金刚石/铜复合材料作为封装材料的优良性能及其制备工艺进展,并对其发展方向进行了展望。The rapid development of electronic technology has led to strict requirement for the properties of electronic packaging material. According to the new development of packaging material, diamond/ Cu composites as a new generation electronic packaging material has received more and more attention. The favorable characteristics and basic preparation technology of Diamond - Cu composite material for electronic packaging are reviewed. And the tendency to develop Diamond - Cu composite material for elec- tronic packaging is reviewed.

关 键 词：电子封装 金刚石/铜复合材料 热导率 热膨胀系数 

分 类 号：TN604[电子电信—电路与系统]