瓷介质电容器银浆堆烧“粘片”讨论  

Sticking Problem Among Silver Electrodes During DC Stack-Fired

作　　者：赵汝云[1] 敖已忠[1] 刘婀娜[1] 

机构地区：[1]中国昆明贵金属研究所

出　　处：《贵金属》1998年第1期14-17,共4页Precious Metals

摘　　要：从浆料的组成和烧成工艺研究瓷介电容器银浆堆烧“粘片”问题。ＤＴＡ和ＳＥＭ分析证实粘片是由于表面银层片间叠压交互烧结形成的，并提出解决方法，以满足生产要求。Sticking problem of the silver electrodes of DC had been studied with changes in compositions of the silver paste and firing technology. The results by DTA and SEM showed that sticking caused during stack-firing because of diffusion. The methods to resolve sticking problem had been presented. The silver paste studied had meeted the requirements for DC production.

关 键 词：圆片电容器 银浆 粘结 堆烧 

分 类 号：TM534[电气工程—电器]