芯片焊锡镀层厚度对工程能力影响研究  

Research into Impacts of Chip Solder-Plating Coat Thickness on Engineering Capability

作　　者：沈泽斌 

机构地区：[1]三星电子(苏州)半导体有限公司,江苏苏州215021

出　　处：《电工电气》2009年第2期57-60,共4页Electrotechnics Electric

摘　　要：芯片焊接工程能力是焊接系统最重要的环节。分析了焊锡镀层厚度和焊锡电镀电流强度对焊接工程能力的影响,给出了焊接弯曲度、贴装粘合度强度、焊锡拉伸能力的测试数据。实验结果表明,芯片焊锡镀层厚度和焊锡电镀电流强度对芯片后期电特性起着关键作用,芯片镀层厚度是焊锡工程能力最为重要的参数。Chip solder engineering capability is the most important link in solder system. Analysis was made to the impacts of solder-plating coat thickness and electro-plating current strength on solder engineering capability. This paper gave out the test data of solder bending angle, mounting sticking strength and solder tension capability. Experimental results show that chip solder-plating coat thick- ness and solder electro-plating current strength play a key role in chip post electrical characteristics, so chip solder-plating coat thickness is the most important parameter for solder engineering capability.

关 键 词：芯片焊接 焊锡镀层厚镀 焊锡工程能力 

分 类 号：TN405[电子电信—微电子学与固体电子学]