基于多元线性回归的PBGA可靠性灵敏度分析  

Reliability Analysis of PBGA Based on Multiple Linear Regression and Global Sensitivity Method Integration

作　　者：李永利[1] 周德俭[1,2] 黄红艳[1] 张立强[1] 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004 [2]广西工学院机械工程系,广西柳州545006

出　　处：《桂林电子科技大学学报》2009年第1期6-10,共5页Journal of Guilin University of Electronic Technology

基　　金：广西研究生创新项目(2008105950802M403)

摘　　要：基于全局灵敏度分析方法,研究了塑封球栅阵列(PBGA)的热机械疲劳可靠性,得出对PBGA热机械疲劳寿命影响较大的设计参数。利用正交试验法,建立BT基板弹性模量、PCB弹性模量和焊球半径不同水平组合下的PBAG有限元模型,并对其进行热应力分析,利用修正后的Coffin-Manson方程对其进行寿命预测。基于多元线性回归法,建立PBGA寿命与关键设计参数的函数关系,并对该方程的预测效果进行验证。结果表明预测结果可信。Based on global sensitivity analysis, the thermo-mechanical fatigue reliability of Plastic Ball Grid Array （PBGA） is studied. Some key technological parameters are obtained which have great influence on the thermo-mechanical fatigue reliability of PBGA. With the application of orthogonal experiment, the finite element modal of PBGA under different parameters combination are established and analyzed. The fatigue life is forecasted by＇ using the modified Coffin-Manson formula. The function relation of fatigue life of PBGA and the key parameters is established based on Multiple Linear Regression. The prediction is proved satisfied.

关 键 词：塑封球栅阵列 多元线性回归 全局灵敏度 可靠性 

分 类 号：TN406[电子电信—微电子学与固体电子学]