用于高功率半导体激光器列阵散热的微通道热沉的研制  

Microchannel heatsink for the heat dissipation of high power semiconductor laser diode arrays

作　　者：唐裕霞[1] 

机构地区：[1]重庆工商大学计算机科学与信息工程学院,重庆400067

出　　处：《重庆工商大学学报（自然科学版）》2009年第1期80-83,共4页Journal of Chongqing Technology and Business University:Natural Science Edition

摘　　要：理论分析了微通道热沉的热阻的组成,采用微机械加工技术和铜直接粘接技术(DBC)制作了冷却大功率半导体激光器列阵的5层结构的无氧铜微通道热沉;通过测试,用其封装的808 nm线阵二极管激光器准连续输出功率达38.5 W,无氧铜微通道热沉热阻为0.645℃/W,热沉的表面温度均匀性好,能有效散热,满足散热要求。The thermal resistance of microchannel heatsink is theoretically analyzed, an Oxygen - free copper microchannel heatsink consisting of five copper sheets is designed and fabricated. By testing, the uniformity of the face temperature of the microehannel heatsink is good. and the therma resistance 1 is 0.645℃/W. the output power of the high power semiconductor diode laser linear arrays packaged with the mierochannel heatsink is 38.5W.

关 键 词：半导体激光器 微通道热沉 热阻 

分 类 号：TN365[电子电信—物理电子学]