超精密双面抛光机结构的优化设计  

Optimized Design of Ultra-precision Double-sided Polishing Machine

作　　者：胡晓珍[1] 李伟[2] 

机构地区：[1]浙江海洋学院,浙江舟山316000 [2]浙江工业大学,浙江杭州310014

出　　处：《制造技术与机床》2009年第3期54-57,共4页Manufacturing Technology & Machine Tool

基　　金：浙江省自然科学基金(M503049);浙江省科技厅重点项目(2004C21007);舟山市科技局项目(05114)

摘　　要：针对传统双面抛光机存在的问题,从实现超精密抛光的设备条件出发,对机床传动系统、主轴支撑结构、上抛光盘加载系统、抛光盘修整、床身等进行优化改进设计。提高了超精密双面抛光机床的精度和系统性能,为晶片获得纳米级加工精度的超光滑加工表面创造了有利条件。In this paper, some problems in the original double-sided polishing machine have been discussed, and for realization of ultra-precision polishing equipment conditions, optimized design was accomplished in transmission system of the machine, structure of the spindle, loading system, repairing plate and the machine main structure, etc.. The stability and accuracy of the ultra-precision double-sided polishing machine have been improved by the optimized structure design and advanced double-sided polishing process, therefore the ultra-smooth surface of the wafer has been got in the new developed double-sided polishing machine.

关 键 词：超精密加工 双面抛光机 优化设计 

分 类 号：TG580.692[金属学及工艺—金属切削加工及机床] TP731[自动化与计算机技术—检测技术与自动化装置]