硅微陀螺仪器件级真空封装  

Device-level Vacuum Packaging of Silicon Microgyroscopes

作　　者：施芹[1] 丁荣峥 苏岩[1] 裘安萍[1] 

机构地区：[1]南京理工大学智能弹药技术国防重点学科实验室,南京210094 [2]无锡中微高科电子有限公司,无锡214035

出　　处：《机械工程学报》2009年第2期243-246,共4页Journal of Mechanical Engineering

基　　金：国家自然科学基金(10572039,10772086);江苏省自然科学基金(BK2005064);江苏省青蓝工程支持计划资助项目

摘　　要：为实现硅微陀螺仪真空封装以提高其性能,对硅微陀螺仪器件级真空封装技术进行研究。首先,设计硅微陀螺仪的专用陶瓷封装管壳,并采用钎焊技术进行封帽,采用金锑合金为焊料以满足封装过程中的高温。分析除气工艺对硅微陀螺仪品质因数的影响,除气试验结果表明,将硅微陀螺仪芯片和封装壳体放置在真空炉中进行高温烘烤,能有效地提高硅微陀螺仪的品质因数。制定硅微陀螺仪器件级真空封装的工艺流程,封装好的硅微陀螺仪的品质因数约为10363.7,约为空气下的50倍。硅微陀螺仪品质因数跟踪测试结果表明,真空封装的硅微陀螺仪存储5个月后,其品质因数降低为最初的55.1%,这表明采用该器件级真空封装技术封装的硅微陀螺仪的真空保持度较差,有待进一步研究。The device-level vacuum packaging technologies of silicon microgyroscopes are studied in order to carry out vacuum packaging of silicon microgyroscopes to improve performance of microgyroscopes. First, the special ceramic packages for silicon microgyroscopes are designed and the soldering sealing technology is adopted. The alloy An/St is adopted to cater for the high temperature in the packaging process. The effects of degassing process on the quality factor of silicon microgyroscopes are studied, and the results of degassing experiments show that the quality factor of silicon microgyroscopes can be effectively improved when the silicon microgyroscopes chips and ceramic packages are baked in vacuum chamber. The device-level vacuum packaging process is established. The quality factor of packaged silicon microgyroscopes is about 10 363.7, which is about fifty times of quality factor of silicon microgyroscopes under ambient atmosphere pressure. The tracking test results of quality factor of silicon microgyroscope show that after the vacuum packaged silicon microgyrscopes are stored for five months, their quality factor is reduced to 55.1% of the original value, which shows that the vacuum retentivity of silicon microgyroscopes packaged with device-level vacuum packaging technology is poor and needs further study.

关 键 词：硅微陀螺仪 器件级真空封装 品质因数 除气工艺 

分 类 号：TH824.3[机械工程—仪器科学与技术] TB7[机械工程—精密仪器及机械]