基于MEMS技术的异平面空心金属微针  

Out-of-Plane Hollow Metallic Microneedle Based on MEMS Technology

作　　者：沈修成[1] 刘景全[1] 王亚军[1] 郭忠元[1] 芮岳峰[1] 

机构地区：[1]上海交通大学微纳科学技术研究院,微米/纳米加工技术国家级重点实验室,薄膜与微细技术教育部重点实验室,上海200240

出　　处：《传感技术学报》2009年第2期151-154,共4页Chinese Journal of Sensors and Actuators

基　　金：微米/纳米加工技术国家级重点实验室基金资助(9140C7903020806);校国防科技发展基金资助(07GFH-BB01-030)

摘　　要：MEMS微针的一个重要应用是透皮给药。文中提出了一种基于MEMS技术的异平面空心金属微针。该微针首先利用硅(100)面刻蚀技术在硅片上刻蚀出深度为330μm的倒四棱锥,然后采用电镀技术电镀出壁厚为50μm的空心金属倒四棱锥。从背面开出微流道并去除残余硅,就得到了倾斜角度为70.6°的异平面金属空心微针。最后采用ANSYS有限元仿真软件建立微针模型,验证了微针具有足够的强度。An important application of MEMS microneedle is transdermal delivery. An out-of-plane metal microneedle is fabricated based on MEMS technology. An inverse pyramid with the depth of 330 μm was first etched on a silicon chip using （100） silicon surface etching technology. Then a hollow metal inverse pyramid with the wall thichness of 50μm was fabricated using electroplating technology. From the back side, micro channel was fabriated and then the silicon left was removed. An out-of-plane metal hollow microneedle with an incline angle of 70. 6% was obtained. Finally, the model of the microneedle is built by the FEM software ANSYS to validate that the microneedle have enough strength.

关 键 词：MEMS 微针 电镀 异平面 药物投送 

分 类 号：TN303[电子电信—物理电子学]