面向电子制造的时间-压力点胶过程建模  

Modeling of Time-pressure Dispensing Process for Electronics Manufacturing

作　　者：陈从平[1] 方子帆[1] 秦武[1] 

机构地区：[1]三峡大学机械与材料学院,湖北宜昌434002

出　　处：《机床与液压》2009年第3期74-76,共3页Machine Tool & Hydraulics

基　　金：高等学校博士科研启动基金资助项目(No.0620070124)

摘　　要：由于胶体(如粘接剂、环氧树脂等)具有明显的非牛顿特性,难以建立一个精确的点胶物理模型。本文作者从分析一类广义幂率流体的动态特性出发,利用参数识别的方法建立了一个既符合点胶物理意义,又易于应用的点胶量预测模型,并给出了参数辨识的方法。仿真和实验验证了该模型的预测精度。Time-pressure dispensing has been widely used in electronics manufacturing. For the dispensing materials such as adhesive, epoxy is non-Newtonian fluid, it is difficult to develop an accurate physical model to predict the fluid volume dispensed. By analyzing the dynamics of generalized power-law fluid, a physical and applied fluid flow rate models was developed with parameter identifying. The simulations and experiments were conducted to verify the effectiveness of the model.

关 键 词：点胶 非牛顿特性 预测模型 

分 类 号：O357[理学—流体力学]