金属纳米微粒导电墨水的研究进展  

Research Progress of Metallic Nano-particles Conductive Ink

作　　者：周荣明[1] 陈明伟[1] 印仁和[1] 郁祖湛[2] 

机构地区：[1]上海大学理学院化学系,上海200444 [2]复旦大学化学系,上海200433

出　　处：《电镀与精饰》2009年第3期16-21,共6页Plating & Finishing

基　　金：国家自然科学基金与上海宝钢股份有限公司联合资助项目50371053;上海市教委第5期重点学科(J50102)资助项目

摘　　要：在电子工业中,平版印制技术在印制电路板制造中被广泛采用,传统制造方法其加工过程至少需要六道工序,在刻蚀过程中大量的金属原材料被丢弃,对板材的腐蚀使其选材受到限制。而以喷墨印制技术为核心的全印制电子技术只要打印和固化两道工序即可,非常简便。对要求不高的电子产品,如电子标签,一般不需要后续化学镀和电镀。对导电线路要求高的,需用化学镀来增厚光滑线路表观和改善线路导电性能。如要求线路厚度高于12μm以上,则需电镀增厚。该工艺所用导电墨水,在表面处理技术中也有着广泛用途。In the electronics industry, lithography technology is widely used in the manufacture of printing circuit board （PCB）. The traditional method for the manufacturing process includes at least six steps of working procedure. In the etching process, a large number of raw materials would be thrown away and the choice of substrate materials is limited as the substrate is easily eroded in etching process. For the ink-jet printing technology employed for the manufacture of PCB, only two steps of working procedure, such as printing and solidifying, are needed, which is very simple. Moreover, for some simple electronic products, such as electronic tags, further electrolcss plating and electroplating procedure are not needed. For some high-quality conducting wire, the electroless plating is needed to thicken and smoothen the wire surface and improve the performance. If the conductive wire is of the thickness over 12μm, the electro- plating procedure is needed for the thickening. The conductive ink used in this technology can also be widely used in the surface treatment.

关 键 词：导电墨水 印制电路板 全印制电子产品 

分 类 号：TN41[电子电信—微电子学与固体电子学]