聚脲包覆KH560硅烷偶联剂微胶囊的制备研究  

Study on the Preparation of Polyurea Coated KH560 Microcapsule

作　　者：魏文政[1] 张扬 林牧春[1] 刘孝会[1] 

机构地区：[1]中国兵器工业第五九研究所,重庆400039 [2]总装驻重庆地区军事代表室,重庆400039

出　　处：《表面技术》2009年第2期55-56,77,共3页Surface Technology

基　　金：装备预研基金项目(9140A18060207BQ1901)

摘　　要：为实现涂层自修复,制备了聚脲包覆KH560硅烷偶联剂微胶囊。研究了温度、搅拌速度和多元胺种类对微胶囊的形貌、粒径大小、分布状况及囊壁强度等的影响。结果表明:在25℃制备的微胶囊为囊泡结构的大粒径微胶囊,在5℃下制备的为小粒径的微胶囊;随搅拌速度的提高,微胶囊的粒径下降,分布变窄;采用三乙烯四胺制备的微胶囊强度高。在5℃下以2 000r/min的速度乳化,采用三乙烯四胺和TDI的三聚体制备的微胶囊是适用于自修复材料的微胶囊。For achieve self-healing coating, the polyurea coated KH560 microeapswe was prepared. The influences of factors such as reacting temperature, stirring rate and amine on the mieroeapsule particle size, granulanrity distribution and shell intensity in the preparation of polyurea coated KH560 microcapsule were studied. The results show that the particle size is big when the mierocapsule is synthesized with big at 25 ℃ and small at below 5 ℃, the particle size becomes smaller and the granulanrity distribution becomes narrower when stirring rate increases, the shell intensity is higher when the microcapsule is made by triethylene tetraamine. The microcapsule prepared by triethylene tetraamine and tri-tolylene-diisocyanate at 5℃ and stirring speed of 2 000r/min is suitable for preparing self healing material.

关 键 词：自修复 界面聚合 聚脲 微胶囊 

分 类 号：TG174.461[金属学及工艺—金属表面处理]