激光数字模切的关键技术  

Key Technologies of Digital Laser Die-cutting

作　　者：张成新[1] 范兆东[1] 陈浩杰[1] 李淑娟[1] 

机构地区：[1]曲阜师范大学,日照276826

出　　处：《包装工程》2009年第4期73-75,共3页Packaging Engineering

基　　金：曲阜师范大学科研项目(XJ0681;XJZ200846;J08LI14)

摘　　要：介绍了传统模切技术存在的诸多弊端,指出数字模切是解决该问题的有效方法。其中激光数字模切成为了模切发展的趋势,介绍了其关键技术,包括适应模切材料的激光器的选择、光束的焦点及焦深控制、飞行光路的相关问题等。这些因素相互影响,设计选择时需综合考虑,以获得综合性能良好的设备。The existing problems of traditional die-cutting technologies were discussed. It was put forward that digital die-cutting is the efficacious way to solve the problems. The key technologies of laser die-cutting were introduced, which include the selection of laser device, focus position control, and light path. It was suggested all these factors should he synthetically considered in order to obtain excellent performance in design and manufacturing.

关 键 词：激光模切 焦点控制 飞行光路 

分 类 号：TS885[轻工技术与工程] TS887