高速混合PCB过孔设计  

Through Hole Design of the High-Speed Hybrid PCB

作　　者：张成刚[1] 王六春[1] 张德斌[1] 

机构地区：[1]南京电子技术研究所,南京210039

出　　处：《微波学报》2010年第S2期257-259,共3页Journal of Microwaves

摘　　要：讨论了一种新型的PCB设计技术,微波板(PTFE)和低频板(FR4)混压构成PCB多层板,这种高度集成实现了系统的小型化、轻型化。在微波低频混合PCB多层板设计中,过孔的设计成为影响高速PCB板信号完整性的一大关键性因素,文中对混合PCB多层板设计中所存在的过孔EMI问题进行了系统的设计分析,当信号在混合PCB多层板层间传输时,实现宽带、低插损、低驻波。A new type design technology of PCB which contains PTFE and FR4 has been investigated.This highly integrated technology realize the miniaturization and light of the system.The design of through hole is very important in high-speed hybrid PCB,which may impact the signal integrity.EMI of the high-speed PCB which took by through hole is researched in this paper, when the signal transfers in the high-speed PCB After optimizing,it can achieve broad band、low insertion loss、low SWR.

关 键 词：混压PCB 多层板 过孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]