基于离子交换与激光打印技术在含氟聚酰亚胺薄膜表面制备银-铜金属线  

Silver-copper micropatterns on fluorinated polyimide film surface by ion-exchange and laser printing technique

作　　者：刘莹[1] 武德珍[2] 崔广辉[1] 齐胜利[2] 孙光[1] 金日光[2] 吴战鹏[1] 

机构地区：[1]北京化工大学化工资源有效利用国家重点实验室,北京100029 [2]北京化工大学碳纤维及功能高分子教育部重点实验室,北京100029

出　　处：《化工新型材料》2010年第S1期99-101,118,共4页New Chemical Materials

基　　金：国家自然基金资助项目(50973006)

摘　　要：以4,4’-六氟亚异丙基-邻苯二甲酸酐(6FDA)和4,4’-二胺基二苯醚(4,4’-ODA)为原料制备了含氟聚酰亚胺薄膜,然后通过水解、激光打印、离子交换、化学还原等技术得到银和铜双金属的图案化聚酰亚胺薄膜。通过X-射线衍射仪、四点探针测试仪、光学显微镜、扫描电子显微镜等仪器系统研究了薄膜表面金属的形成过程及水解时间与导电性的关系。实验结果表明,随着水解时间的增加,金属线条的导电性逐渐增加,电导率最大达到500s/cm。Silver-copper micropatterns on fluorinated polyimide films were fabricated based on the synthsis of poly(amic acid)s which were prepared from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride(6FDA) and 4,4'-diaminodiphenyl ether (ODA) and then by thermal curing of the poly(amino acid) precursor led to cycloimidization. Through subsequent hydrolysis reaction,laser printing,ion-exchange reaction and chemical reduction,silver and copper bimetallic patterns on polyimide films was achieved. Films were characterized by X-ray diffraction,four-point probe mesurement,optical microscope,scanning electron microscopy. Results showed that with the increase of hydrolysis time of the PI matrix,the conductivity of metal lines gradually increase.

关 键 词：图案化 聚酰亚胺 激光打印 化学镀铜 电导率 

分 类 号：TB383.2[一般工业技术—材料科学与工程]