RFIC结构性测试分析  

Analysis of RFIC Structural Testing

作　　者：谢暄[1] 姜书艳[1] 

机构地区：[1]电子科技大学自动化工程学院,成都610054

出　　处：《微电子学》2009年第2期247-250,共4页Microelectronics

基　　金：国家自然科学基金资助项目(90407007)

摘　　要：随着半导体技术的进步,RFIC取得了飞速的发展,并在多个领域获得了广泛的应用。然而,仍有许多因素制约了RFIC的发展。RFIC测试正是制约RFIC发展的主要瓶颈之一。文章分析了RFIC测试的挑战,介绍了基于热量监测、敏感性分析和神经网络等不同关键技术的RFIC结构性测试方法;指出RFIC的结构性测试方法是功能性测试方法的有效补充,也是降低测试成本的有效方法之一。RFIC technology has grown up amazingly along with the development of semiconductor technology. However, there are also many challenges to RFIC＇ s development. Among them, RFIC test is a major bottleneck. In this paper, challenges of RFIC test and three typical RFIC structural test methodologies based on different key technologies, such as thermal monitoring,sensitivity analysis,and neural networks,were analyzed. It is concluded that RFIC structural test is an effective supplement to functional test, and it is also an effective technique to reduce test cost.

关 键 词：RFIC 结构性测试 热量监测 敏感性分析 神经网络 

分 类 号：TP206.3[自动化与计算机技术—检测技术与自动化装置]