CPU散热技术的最新研究进展  

Recent Advance in Cooling Techniques for CPU

作　　者：高翔[1] 凌惠琴[1] 李明[1] 毛大立[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室,上海200030

出　　处：《上海交通大学学报》2007年第S2期48-52,共5页Journal of Shanghai Jiaotong University

基　　金：国家自然科学基金资助项目(90406013);上海市纳米科技基金资助项目(0452nm030)

摘　　要：随着芯片集成度的不断提高,为CPU提供有效的散热方案成为电子行业的重要研究课题.针对CPU热障问题,着重讨论了热管、微通道和制冷芯片3种新型微冷却方式的发展现状、传热原理以及应用前景,分析了它们各自的优缺点和有待解决的问题,并对这一领域的发展前景作了展望.With the improvements on the chip integration density,providing effective heat removal solutions for CPU is an essential research project in the electronics industry.Taking aim at the problem caused by heat generation of CPU,this paper mainly discussed the current developments,principles of heat transfer and perspective applications of the three novel microcooling methods,including heat pipe,microchannel and cool chip.Advantages and shortcomings of those methods and the relative critical issues were evaluated.Prospect in the chip cooling area was also stated.

关 键 词：芯片冷却技术 热管 微通道 制冷芯片 

分 类 号：TP332[自动化与计算机技术—计算机系统结构]