无铅镀层锡晶须问题的研究进展  

Review of Researches for Tin Whisker on Lead-free Finishes

作　　者：刘萌[1] 冼爱平[1] 

机构地区：[1]中国科学院金属研究所沈阳材料科学国家(联合)实验室,辽宁沈阳110016

出　　处：《材料科学与工程学报》2009年第2期314-323,328,共11页Journal of Materials Science and Engineering

基　　金：国家科技部863计划资助项目(2002AA322040)

摘　　要：全球电子封装行业的无铅化趋势,使得镀层锡晶须自发生长的问题变得十分突出。由于晶须的导电性可以引起高密度封装引脚之间短路,从而使电子产品失效甚至引发灾难性的事故,因此研究并阐明锡晶须生长机理、探索有效抑制锡晶须生长的手段、寻找合适的锡晶须生长加速实验方法评估电子产品的可靠性,成为当前亟需解决的问题。本文从锡晶须问题的由来,锡晶须的危害、锡晶须生长的机理、影响锡晶须生长的因素、抑制锡晶须生长的方法和锡晶须生长加速实验方法等几个方面,对锡晶须问题尤其是近年来这方面的研究进展作一简要评述,并提出一些需要研究的课题。With global lead-free trend in the electronic package, the problem of the whisker on tin finishes becomes outstanding. Tin whisker can cause a short-circuit in the high density electronic package, which should result in the failure of an electronic device or even a catastrophic accident. Therefore, it is imperative to investigate tin whisker growth mechanism, to look for the effective mitigation strategies and suitable accelerating test methods to study and assess the reliability of the electronic device. The present paper will review the aspects above on the researches especially focus on the recent results of the tin whisker growth. Finally, some interesting issues in this area are also suggested.

关 键 词：电镀 锡晶须 生长机理 无铅焊料 综述 

分 类 号：TQ153.13[化学工程—电化学工业]