刚挠背板动力学仿真与焊点可靠性研究  

Study on dynamics simulation and reliability of solder joints of rigid-flex backplane

作　　者：史经辉[1,2] 吴兆华[1] 黄春跃[1] 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004 [2]南通航运职业技术学院,江苏南通226010

出　　处：《电子元件与材料》2009年第5期73-76,共4页Electronic Components And Materials

基　　金：国防预研资助项目;广西研究生科研创新资助项目(No.200810590802M405)

摘　　要：根据通信设备中刚挠背板互联结构,建立了有限元模型。采用两种约束方案,通过模态分析获得其固有频率和振型;通过随机振动分析,获得其应力应变;根据Coffin-Manson经验公式,结合三带技术建立了互联焊点的振动疲劳寿命预测模型,并计算了其疲劳损伤。结果表明:备用状态下互联结构的一阶固有频率为141Hz,工作状态下为988Hz;随机振动负载条件下刚挠结合部位及焊点与刚性背板连接区为应力集中区;对备用状态下互联结构施加z方向激励,焊点的疲劳损伤最大。Based on the rigid-flex backplane interconnect structure of communication equipments, the finite element model （FEM） was set up. Using two types of constraint programme, the natural frequency and vibration modes were obtained through modal analysis. After random-vibration analysis, stress and strain of the interconnect structure were obained. According to Coffin-Manson experience formula combining with three-band technology, the interconnect solder joints vibration fatigue life prediction model was developed and the fatigue damage was calculated. The results show that the interconnect structure has 141 Hz of the first order natural frequency under stand-by state while 988 Hz under working state; the connections between rigid and flexible parts, solder joints and the rigid backplane are stress concentration areas under random-vibration loading conditions, fatigue damage on solder joints is the maximum when the interconnect structure under stand-by state is exerted z direction incentives.

关 键 词：刚挠背板 焊点 可靠性 

分 类 号：TN406[电子电信—微电子学与固体电子学]