压电厚膜的研究现状及趋势  

Status and Future Trend of Piezoelectric Thick Films

作　　者：熊龙宇[1] 姜胜林[1] 曾亦可[1] 张海波[1] 王青萍[1] 

机构地区：[1]华中科技大学电子科学与技术系教育部敏感陶瓷工程研究中心,武汉430074

出　　处：《材料导报》2009年第9期35-38,共4页Materials Reports

基　　金：国家高技术863计划(2007AA03Z120);国家自然基金(60777043)

摘　　要：随着电子元器件向小型、高灵敏、集成、多功能化方向发展,薄/厚膜材料及器件逐渐成为研究的重点。由于压电厚膜(10～100μm)兼具有压电陶瓷与压电薄膜的优点,是各种微型传感器和执行器的核心部分,已引起世界各国研究者极大的兴趣,但是大多数研究还处于实验阶段。评述了压电厚膜的制备方法、测试表征以及应用状况,归纳了压电厚膜研究的现状及发展趋势,指出了其中存在的问题及解决办法,并对压电厚膜今后的研究提出了一些建议。Due to the drive for miniaturization, high power/sensitivity, multi-function and system integration with the electric circuits, thin/thick film material and device have gained more emphasis. Piezoelectric thick film （10-100μm thick）, the core of various micro-sensors and actuators, which has the merits of both the bulk material and thin film, has attracted researchers from all over the world. But most researches are just in the experimental stage. In this article a review of a range of techniques for the thick films deposition, testing and measurement, and the applications of the piezoelectric thick films are given. The status, technique difficulties and future trend of the research on piezoelectric thick films are surnmaried. The methods to solve these problems are pointed out, and advices on the future research of the thick films and thick film devices are given.

关 键 词：压电厚膜 压电测试 压电器件 

分 类 号：TM282[一般工业技术—材料科学与工程]