硅树脂凝胶在铁路信号产品灌封中的工艺研究  

Technics Research of Silicone Gel Potting in Communication Equipments

作　　者：陈优珍 

机构地区：[1]中国铁路铁路信号集团北京铁路信号工厂,北京102613

出　　处：《电子工艺技术》2009年第3期172-174,共3页Electronics Process Technology

摘　　要：介绍硅树脂凝胶和环氧树脂等灌封材料的特点,比较它们的优缺点;指出各种灌封材料对印制电路板组件(PCBA)性能的影响;详细说明在铁路信号产品生产中应用双组份硅树脂凝胶灌封印制电路板组件的关键工艺,包含了PCBA表面清洁、凝胶温度控制、配方管理和控制、抽真空消除凝胶中的气泡、凝胶的灌封有效期管理、固化过程管理等;比较并选择各个关键工艺过程的实施方案,特别提出灌封有效期管理的新观点,并进行了实践和总结。Introduce potting materials, such as silicone gel and epoxy, and compare their advantage and disadvantage. Point out that printed circuit board assembly（PCBA） performance may be impacted by potting materials on it;Explain the key process technique which applies two components of silicone gel to printed circuit boards in communication ＆ signals equipments in detail,including cleaning the surface of the PCBA, gel temperature control, recipe management and control, vacuum for eliminating air bubbles in the gel, potting life manage of gel, the process of curing, and curing time management. Propose a special and the newest view of potting life and potting life management.

关 键 词：硅树脂凝胶 灌封 印制电路板组件 

分 类 号：TN605[电子电信—电路与系统]