纳米焦点X射线管和纳米CT检测集成电路封装中的微型互联(英文)  

Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-ray tubes and nanoCT

作　　者：Zhenhui He Quan wen Xiaojie Huang 

机构地区：[1]GE Sensing ＆ Inspection Technologies, phoenixlx-ray, Wunstorf, Germany [2]GE Sensing ＆ Inspection Technologies, phoenixlx-ray, Shanghai, China

出　　处：《电子工业专用设备》2009年第5期51-54,共4页Equipment for Electronic Products Manufacturing

摘　　要：IC封装中嵌入的微型电路连接可以通过纳米焦点X光光管技术和纳米焦点CT来检测;包括铜或金焊线、堆叠芯片、倒装焊接、微穿孔连接的封装形式。生动地描述了2维3维X射线影像技术,并且呈现了亚微米分辨率的各种分析结果和缺陷案例。Miniaturised and concealed electrical interconnections in IC packages including copper and gold wire bonds, stack dies, flip chips and microvias were inspected by nanofocus X-ray tube technology and nanofocus computed tomography. The 2D and 3D X-ray imaging technology is concisely described and various analysis results and defect examples at sub-micrometer resolution are presented.

关 键 词：对准系统 步进光刻机 对准方式 对准模型 

分 类 号：TN305.90[电子电信—物理电子学]