磁性元件裂纹控制工艺技术研究  

Solutions to Cracks on Magnetic Components

作　　者：向敏[1] 马文利[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2009年第3期445-448,共4页Microelectronics

摘　　要：对磁性元件在灌封后出现裂纹的问题进行了研究。介绍了灌封料对磁性元件的影响,分析了磁件裂纹的原因并进行试验验证。通过在磁件上粘贴胶带设置缓冲层的方式,吸收磁件与灌封料之间的应力,有效解决了灌封后磁性元件裂纹问题,提高了模块组件的可靠性。Cracks on magnetic components introduced in encapsulation were investigated. Effects of materials for encapsulation on magnetic component were discussed. Causes for cracks on magnetic components were analyzed, and experiments were made for verification. By attaching adhesive tapes on magnetic components as a buffer to absorb stress between magnetic components and encapsulating materials, cracks on magnetic components after encapsulation were avoided, and the reliability of the circuit module was improved.

关 键 词：灌封胶 功率电源 模块 温度应力 磁罐 裂纹 

分 类 号：TN304[电子电信—物理电子学] TN306