半导体器件生产中的静电与防护  

Electrostatic and Electrostatic Protection in Manufacturing of Semiconductor Devices

作　　者：崔波[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2009年第6期531-534,共4页Semiconductor Technology

摘　　要：绝大多数半导体器件都是静电敏感器件,而在生产过程中静电又是无处不在的,生产厂必须对静电防护措施给予充分的重视。生产厂应通过对器件采用防静电设计,并在生产过程中对静电采用泄漏、屏蔽和中和等控制原理,采取静电接地、穿戴防静电工作服、使用防静电台面、地面、工具及周转箱、防静电包装袋等措施,建立一个完整的静电防护体系。生产厂还应建立防静电系统的周期测试和监控制度,保证防静电设施起到有效的防护作用,避免和减少器件在生产过程中的静电损伤,交付用户高质量高可靠的产品。Almost all of the semiconductor devices are electrostatic sensitive devices, and the electrostatic exists almost everywhere in the manufacture process, therefore the device manufacture must pay more attention on the electrostatic protect actions. The manufacture should adopt the electrostatic protect design method, using the controling theories such as leakage, shield, and neutralization, making the electrostatic grounding, wearing electrostatic protect clothes, using electrostatic protect table-board, ground, tools and delivery boxes, electrostatic protect packages, etc. to set up a completely protection system. The manufacture also should set up a periodic testing and monitoring system to assure the effectiveness of the electrostatic protect actions, and avoid or lessen the electrostatic damage during the manufacturing, deliver high quality, high reliability products to the consumer.

关 键 词：半导体器件 静电损伤 静电放电 防静电措施 

分 类 号：TN303[电子电信—物理电子学] O44[理学—电磁学]