Sn-Cu基多组元无铅钎料组织、性能及界面反应研究  

Microstructure,Mechanical Property and Interfacial Reaction of Sn-Cu Based Multicomponent Lead-Free Solders

作　　者：赵宁[1] 马海涛[1] 王来[1] 

机构地区：[1]大连理工大学三束材料改性国家重点实验室,辽宁大连116024

出　　处：《稀有金属材料与工程》2009年第A01期107-111,共5页Rare Metal Materials and Engineering

基　　金："十一五"国家科技支撑计划重点项目(2006BAE03B02)

摘　　要：研究了多组元无铅钎料Sn-2Cu-0.5Ni和Sn-2Cu-0.5Ni-0.5Au的熔化行为、微观组织、力学性能及与Ni基板的钎焊反应。结果表明:Au的引入降低了钎料合金的熔化温度;2种钎料基体中的金属间化合物(IMC)均基于Cu6Sn5结构,且在260℃下与Ni基板钎焊60s后在接头界面处均生成棒状的(Cu,Ni)6Sn5;通过拉伸试验得到了2种钎料的抗拉强度和延伸率。The melting behavior, microstructure, tensile property and interracial reactions with Ni substrates of two multicomponent solders, namely Sn-2Cu-0.5Ni （SC-Ni） and Sn-2Cu-0.5Ni-0.5Au （SC-NiAu） were studied. Results show that the addition of Au decreases the melting point of SC-NiAu alloy. The intermetallic compounds （IMC） of the two solders formed in the matrixes are both based on Cu6Sn5 structure. After soldered with Ni substrate at 260℃ for 60 s, stick-like （Cu,Ni）6Sn5 IMC are found at SC-Ni/Ni and SC-NiAu/Ni interfaces. The tensile strength and elongation percentage are obtained by tensile tests, and comparisons are made with eutectic Sn-0.7Cu alloy.

关 键 词：多组元无铅钎料 SN-CU DSC 力学性能 界面反应 

分 类 号：TG425.1[金属学及工艺—焊接]