Si/SiC复相陶瓷与殷钢钎焊接头组织结构研究  

Microstructures of Si/SiC Ceramic and Invar Alloy Brazing Joint

作　　者：张志远[1] 黄继华[1] 张华[1] 赵兴科[1] 班永华[1] 

机构地区：[1]北京科技大学,北京100083

出　　处：《稀有金属材料与工程》2009年第A01期493-496,共4页Rare Metal Materials and Engineering

摘　　要：以Ti、Cu混合金属粉末为钎料真空钎焊Si/SiC复相陶瓷与殷钢,通过扫描电镜、能谱仪、X射线衍射对接头组织结构进行分析。结果表明:Ti-Cu钎料对陶瓷和殷钢都具有良好的润湿性;在980℃保温10min条件下形成良好的连接接头,连接层主要由Ti-Cu化合物和Ti5Si3相组成,在连接层与陶瓷界面生成TiSi2、Ti3SiC2和TiC反应层;在980℃保温15min条件下,连接层中生成的化合物种类没有变化,但在近缝区的陶瓷中产生了横向裂纹,导致接头强度急剧下降。接头室温剪切强度在980℃保温10min时最高达到90MPa。Vacuum brazing of Si/SiC ceramic and invar alloy was carried out using Ti and Cu mixed powders as filler metals. The microstructure of the joint was investigated by use of SEM and XRD. The results show that the Ti-Cu filler metals have a good wettability on the ceramic and the invar alloy. At 980 ℃ for l0 rain, the brazing layer is mainly composed of Ti-Cu and Ti5Si3; the reaction layer is mainly composed of TiSi2, Ti3SiC2 and TiC. At 980 ℃ for 15 rain, products in the brazing layer did not change, but flaws appeared in the ceramics near bonding layer which induce a sharp decline of the joint strength. The joint strength reaches the maximum 90 MPa at 980 ℃ for 10 rain.

关 键 词：Si/SiC复相陶瓷 殷钢 真空钎焊 界面反应 

分 类 号：TG407[金属学及工艺—焊接]