电流密度对电铸铜晶粒组织的影响  

Influence of Current Density on Grain Structure of Electroformed Copper

作　　者：关丽雅[1] 郑秀华[1] 王富耻[1] 李树奎[1] 

机构地区：[1]北京理工大学,北京100081

出　　处：《稀有金属材料与工程》2009年第A01期524-529,共6页Rare Metal Materials and Engineering

摘　　要：采用脉冲电源、酸性硫酸铜电铸液制备一定厚度的电铸铜,研究脉冲电流密度对电铸铜晶粒组织的影响。利用IPP(Image-Pro Plus)图像分析软件测量晶粒组织特征参数,计算得到晶粒分布几率,建立电流密度与各种组织参数平均值的定量关系,获得电流密度对电铸铜组织形态的影响规律,并分析了其影响机制。结果表明,在占空比为80%和频率为200Hz的条件下,当电流密度从2A/dm2升高到6A/dm2,铸层中等轴晶的分布几率增加,晶粒的空间数量密度增加,晶粒长轴、短轴及面积平均值降低。The pulse power and electroforming acid copper sulfate solution were used to prepare pure copper layers. The influence of current density on the grain structure of eleetroformed copper layers was investigated. Image-Pro Plus （IPP） image analysis technique was employed to measure various grain characteristic parameters and the grain distribution probabilities with different values for various characteristic parameters were calculated. The quantitative relationships between the average values and current density for various characteristic parameters were obtained. The influence of current density on grain structure of electroformed copper layers was discussed. The results show that under the condition of the duty cycle of 80% and frequency of 200 Hz, the distribution probabilities of equiaxed grain and the grain number per unit volume Nv increase and the average values of both long/short axis ratio and grain area decrease as the current density increases from 2 A/dm^2 to 6 A /dm^2.

关 键 词：定量金相分析 特征参数 电铸 铜 电流密度 

分 类 号：TG146.11[一般工业技术—材料科学与工程]