磁控溅射工艺参数对Cu,Al薄膜与Gd基底附着性的影响  

Effect of Process Parameters on the Adhesion of Magnetron Sputtered Copper and Aluminum Coatings on Gadolinium Substrate

作　　者：郑小秋[1] 吴卫[2] 易荣喜[1] 万建新[1] 龙岸文[1] 

机构地区：[1]井冈山大学工学院,江西吉安343009 [2]西华大学材料学院,四川成都610039

出　　处：《材料保护》2009年第6期29-31,共3页Materials Protection

基　　金：国家863基金资助项目(2002AA324010)

摘　　要：为了探讨Gd表面溅射保护膜的附着性能,利用直流磁控溅射技术在Gd基体上分别镀Cu和Al膜。用扫描电镜(SEM)和能谱仪对薄膜进行表征,用引拉法测定了薄膜的附着强度。结果表明:Al膜表面质量好,Al/Gd界面结合好,附着强度高,在优化工艺参数条件下薄膜附着强度可达到27.60MPa;Cu膜表面质量较差,Cu/Gd界面结合差,附着强度低,在优化工艺参数条件下薄膜附着强度最高仅为3.02MPa。Cu and Al coatings were prepared on Gd substrate by making use of direct current magnetron sputtering technology.The characteristics of the coatings were investigated using a scanning electron microscope(SEM)and an energy dis-persive spectrometer(EDS).The adhesion to substrate of the coatings was tested using tension test.It was found that magne-tron sputtered Al coating had good surface quality and adhesion to substrate,and the one prepared at optimized sputtering parame-ters had s highest adhesion to substrate of as much as 27.60 MPa.Contrary to the above,magnetron sputtered Cu coating was rough and of poor appearance and adhesion to substrate.The Cu coating prepared at optimized sputtering parameters had a highest adhesion to substrate of only 3.02 MPa.

关 键 词：磁控溅射 Cu Al薄膜 附着强度 Cd基底 正交试验 

分 类 号：TG174.4[金属学及工艺—金属表面处理]