Ni-P化学镀反应速率及机理研究  

Study on the Reaction Rate and Mechanism of Ni-P Electroless Plating

作　　者：张国栋[1] 

机构地区：[1]华东冶金学院化工系,马鞍山243002

出　　处：《物理化学学报》1998年第5期429-434,共6页Acta Physico-Chimica Sinica

摘　　要：通过镀层分析和析氢量测量得到Ni-P镀层的沉积速度和H2PO2的分解速度·以混合电位理论为基础，对Ni－P电极在不同组成饮液中的极化曲线进行分解得到以化学镀电流形式所表示的反应速率·将两种方法所得结果进行对照，确定H2PO2氧化时电子迁移数为1，并用原子红-电化学联合理论解释溶液PH对反应速率及化学镀效率的景响．The deposition rate of Ni-P electroless coating and the decomposition rate of H2PO, were studied by analyzing the mass and the P content of the electeroless coating, and by measur-ing the volume of the evolved hydrogen. Based on the mixed potential theory, electroless plating current, which can be expressed by the reaction rate, was obtained by analyzing the polarzation curves of Ni-P in solutions of various composition. The reaction is consistant with the one electron transfer mechanism. The influnce of the solution pH on electeoless plating rate and electroless Plating effeciency was explained.

关 键 词：NI-P 化学镀 反应速率 反应机理 镍 磷 

分 类 号：O646.54[理学—物理化学] TQ153[理学—化学]