表面组装焊点形态模型的建立及求解  

The Establishment and Solution of a Shape Model of Soldered Joints of Surface Mount

作　　者：韩运侠[1] 张柯柯[2] 

机构地区：[1]洛阳师范学院物理与电子信息学院,河南洛阳471022 [2]河南科技大学材料科学与工程学院,河南洛阳471003

出　　处：《数学的实践与认识》2009年第11期57-61,共5页Mathematics in Practice and Theory

基　　金：河南省科技攻关项目资助(072102260016)

摘　　要：基于SnAgCuRE钎料焊点成形时受力平衡方程,根据表面组装RC1206元件焊点结构,采用数学分析方法建立了焊点形态的数学模型,预测了片式元件的SnAgCuRE钎料焊点形态.Based on the force equilibrium equations obtained by the solder shape of the SnAgCuRE filler metal, according to the frame of soldered joints of the surface mount RC1206, The shape mathematic model of soldered joints is established applying the math analysis method in this paper, and the shape of soldered joints chip component SnAgCuRE is also forecasted.

关 键 词：表面组装 可靠性 SnAgCuRE 焊点形态 数学模型 

分 类 号：TG40[金属学及工艺—焊接]