光纤光栅紫铜片封装结构及温度敏感特性研究  

Study on Red Copper Slice Packaging Structure and Temperature Sensitivity Characteristics for Fiber Grating

作　　者：王文华[1] 石友彬[1] 熊正烨[1] 师文庆[1] 田秀云[1] 费贤翔[1] 林钧岫[2] 陈春雷[1] 

机构地区：[1]广东海洋大学理学院,广东湛江524088 [2]大连理工大学物理与光电工程学院,辽宁大连116024

出　　处：《半导体光电》2009年第3期400-402,407,共4页Semiconductor Optoelectronics

摘　　要：研究了光纤布拉格光栅的封装及其布设工艺,以及封装后的传感理论,提出并实现了一种光纤布拉格光栅的封装工艺,即用导热性能良好的紫铜片对光纤布拉格光栅进行封装,这种封装结构简单小巧。通过实验对裸光栅和封装后光纤布拉格光栅的温度传感特性进行了研究。研究表明:经过紫铜片封装的光纤布拉格光栅,其温度灵敏系数比裸光纤光栅的提高了2.94倍,有助于提高解调设备的温度分辨率,可以探测到0.03℃的温度变化,且重复性好;该封装结构利用了紫铜的耐腐蚀性,适用于分布式传感网络,便于工程应用。Studied are the,packaging and embedding technique for the FBG temperature sensors, as well as their sensoring principles. Presented is the scheme of packaging technique of the FBG with a compact structure by using the red copper slice. The temperature sensor characteristics of the bare FBG and the packaged FBG were researched. The results indicate that the temperature sensitivity coefficient of the packaged FBG is 3.94 times as much as that of the bare FBG, and the packaging technique improves the temperature resolution of the demodulation equipment, being capable of measuring the change of 0.03 ℃ and owns a good repeatability. This FRG packaging structure based on the corrosion resistance of red copper for FBG can be used to build the distributed sensor network, and the FBG packaged sensor can be easily used in engineering.

关 键 词：光纤布拉格光栅 封装工艺 温度传感 

分 类 号：TN253[电子电信—物理电子学]