封装材料对光纤器件的性能影响  

The Influence of Package Materials on Optical Performance of Fiber Devices

作　　者：帅词俊[1] 彭淑平[1] 齐欢[1] 邱庆军[1] 

机构地区：[1]中南大学机电工程学院现代复杂装备设计与极端制造教育部重点实验室,长沙410083

出　　处：《半导体光电》2009年第3期411-413,463,共4页Semiconductor Optoelectronics

基　　金：国家自然科学基金项目(50605063;50875267)

摘　　要：为查明熔锥型光纤器件封装材料对器件光学性能的影响,基于弱波导耦合模理论,建立了封装材料折射率与光纤耦合器分光比的数学模型,找到了它们之间的关联规律。以六轴光纤耦合器熔融拉锥机制作耦合器样品,以H2O与NaCl的不同配比实现封装材料折射率的变化,进行了相应的光学实验。实验结果表明:光纤耦合器的分光比对封装材料的折射率很敏感,折射率在一定的范围内,随着封装材料折射率的增大,耦合器分光比增大,并且具有单调性。这为封装材料的选取提供了理论依据与实验指导。To find out the influence of package materials on the optical performance of fused taper devices, based on coupled-mode theory of weak wave-guide, the mathematical model between the splitting ratio and refractive index of package materials was built up, and their relationship is also found. The experimental research is carried out by using a six-axis fused biconical taper machine to fabricate couplers as samplers and by using H2O and NaCl to get the solution of the changeable refractive index. The experimental results show that the relationship between the splitting ratio and refractive index is linear increasing and monotonic within a certain range of refractive index. It provides the theoretical basis and experimental instruction for selecting the package materials.

关 键 词：光纤器件 分光比 折射率 

分 类 号：TN253[电子电信—物理电子学]