金属封装外壳电镀层均匀性研究  

Research on Uniformity of Plating Layer on Metal Sealed Package

作　　者：杨磊[1] 阚云辉[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230022

出　　处：《混合微电子技术》2009年第1期27-32,共6页Hybrid Microelectronics Technology

摘　　要：本文研究了金属外壳的镀镍层均匀性以及和电镀挂具、电镀参数的关系，并提出了改进措施。研究结果表明，电镀层存在着较严重的厚度不均匀性，高电流密度区如引线、封口处厚度明显高于内腔，影响金属外壳引线的弯曲性能及封盖性能。通过电镀挂具的优化、改进，能改善电镀层的分布，提高电镀层均匀性，外壳的防护性及功能性均得到提高；通过运用多波形电镀技术也能提高镀层的均匀性．Uniformity of nickel plating laver on metal sealed package and relationship between plating jigs and plating parameters are studied in this paper. Improvements are proposed as well. The study results show that thickness of plating layer is severely not unified,and thickness of high current density area such as thickness of leads and sealing area is obviously thicker than that of cavity area, which affects characteristics of lead bending and sealing hermeticity. By ways of optimizing plating jigs, distribution and uniformity of plating layer can be improved. Protection ability and functionality of packages can be cnhaced as well. With the exercise of muhi - wave plating technology, uniformity of plating layer can also be improved.

关 键 词：金属外壳 电镀层 厚度 均匀性 

分 类 号：TQ153[化学工程—电化学工业]