Ni-SiC复合电镀工艺的优化及镀层结构表征  

Optimization and structural characterization of Ni-SiC composite electroplating

作　　者：郑华明[1] 黄新民[1] 何素珍[1] 林志平[1] 单传丽[1] 

机构地区：[1]合肥工业大学,安徽合肥230009

出　　处：《电镀与涂饰》2009年第6期5-8,共4页Electroplating & Finishing

摘　　要：利用电沉积法制备出Ni-SiC复合镀层,研究了阴极电流密度、温度、pH、搅拌速率、表面活性剂等工艺参数对镀层显微硬度和沉积速率的影响,通过正交试验得出了最佳工艺参数:阴极电流密度4A/dm2,SiC微粒悬浮量60g/L,温度40°C,pH2.5,搅拌速率300r/min。用SEM、XRD和TEM分析了镀层的表面形貌、组织结构及镀层中粒子的分布,结果表明:SiC微粒均匀分布于复合镀层中,镀层表面平整光滑,显微组织均匀、致密,其显微硬度也较纯镍镀层有显著提高。A Ni-SiC composite deposit was prepared by electrodeposition. The effects of cathodic current density, temperature, pH, stirring rate and surfactants on the microhardness and deposition rate of Ni-SiC composite were studied. The optimal process parameters were determined by orthogonal test as follows： cathodic current density 4 A/dm^2, suspension amount of SiC 60 g/L, temperature 40 ℃, pH 2.5, and stirring rate 300 r/min. The surface morphology and microstructure of Ni-SiC composite deposit were analyzed by XRD and SEM. The distribution of SiC particles in deposit was observed by TEM. The results showed that SiC particles are uniformly distributed in the composite deposit. The Ni-SiC composite deposit features smoothness, compact microstructure, and greatly improved microhardness as compared with pure nickel deposit.

关 键 词：镍 碳化硅 复合电沉积 组织结构 表面形貌 

分 类 号：TQ153.2[化学工程—电化学工业]