添加铜对Sn-9Zn无铅钎料性能的影响  

Effect of Cu addition on Sn-9Zn lead-free solder properties

作　　者：黄惠珍[1] 廖福平[1] 魏秀琴[1] 周浪[1] 

机构地区：[1]南昌大学材料科学与工程学院,南昌330031

出　　处：《焊接学报》2009年第6期30-33,38,共5页Transactions of The China Welding Institution

基　　金：江西省重大科技攻关资助项目(2005半导体照明专项);江西省教育厅科技项目(赣教技字[2007]53号)

摘　　要：采用向钎料合金熔体中添加铜粉的方法得到了原位生长金属间化合物颗粒增强的Sn-Zn基复合无铅钎料,并对其熔化行为、组织、力学性能和在铜基体上的润湿性进行了研究.差示扫描量热计(DSC)测量结果表明,少量铜粉对Sn-9Zn的熔点影响较小,但铜粉添加量达3%时将使其熔点急剧升高.铜粉的添加使Sn-9Zn钎料中形成了较均匀分布的Cu5Zn8化合物颗粒相,同时棒状富Zn相相应减少.力学性能测试结果显示,复合钎料的抗拉强度和塑性都得到了改善,抗蠕变性能显著提高;润湿性测量表明,复合钎料对铜的润湿性也有所改善.Reinforced Sn-Zn-based composite solders of in-situ IMC particle were obtained by adding Cu powders into Sn-9Zn melts.The melting behavior,microstructures,mechanical properties and the wettability to Cu of the solders were studied.The results show that the effect of a small amount Cu on the melting behavior can be negligible,but 3 wt.% Cu powder addition can increase its liquidus temperature.Cu5Zn8 particles are formed and distributed uniformly in the solders.The coarse rod-like Zn-rich phase decreases with the addition of Cu powder.The strength and plasticity of the solder are improved,and the creep resistance of the solder is considerably enhanced.Wettability of these composite solders is also better than that of Sn-9Zn.

关 键 词：无铅钎料 锡锌合金 原位生长 复合增强 润湿 

分 类 号：TG4[金属学及工艺—焊接]