Cu-Sn-Zn三元无氰仿金电镀工艺研究  

Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating

作　　者：王晓英[1] 毕成良[1] 李新欣[1] 张宝贵[1] 

机构地区：[1]南开大学环境科学与工程学院,天津300071

出　　处：《南开大学学报（自然科学版）》2009年第3期65-70,共6页Acta Scientiarum Naturalium Universitatis Nankaiensis

摘　　要：采用焦磷酸盐Cu-Sn-Zn三元碱性仿金镀体系新工艺,通过改进镀液配方,进行正交试验,得到最佳工艺条件为:实验温度37℃,pH值8.5,电镀时间45 min和电流密度0.20 A/dm^2。以仿金镀速率、外观状况作为衡量标准,重点研究了镀液温度、电流密度对仿金镀镀速和镀层颜色的影响及电镀时间对镀层厚度的影响。结果表明,在其它条件既定的情况下,延长电镀时间可得到传统电镀镀层厚度20倍的镀层。The best process condition was obtained by improving the formula of the bath and orthogonality experiments while new process of alkaline Cu-Sn-Zn pyrophosphate gold imitation plating system was used. Experimental temperature was 37 ℃, pH= 8.5, plating time was 45 min and electric current density was 0. 20 A/dm^2. Setting the rate of plating, appearance condition and corrosion resistance of the coating as a measure standard, the effect of temperature and electric current density on the rate of gold imitation plating and the color of coating as well as the effect of plating time on the thickness of the coating have been discussed. As a result, coating of 20 times as thick as the traditional plating was gained by extending the plating time while other condition was fixed on.

关 键 词：无氰 仿金镀 焦磷酸盐 正交试验 

分 类 号：TQ153.15[化学工程—电化学工业]