多LED组合照明设计的关键技术  

Key Technology of Multi-LED Lighting Design

作　　者：吴海彬[1] 何素梅[1] 王昌铃 

机构地区：[1]福州大学机械工程及自动化学院,福建福州350108 [2]福建省苍乐电子企业有限公司,福建福州350007

出　　处：《液晶与显示》2009年第3期453-458,共6页Chinese Journal of Liquid Crystals and Displays

基　　金：福建省自然科学基金项目(No.A0610010)

摘　　要：多LED组合型光源在灯具设计中应用日益广泛。多LED组合型光源既可以通过把多颗LED芯片直接封装在一个单体内,也可以把多颗封装好的单芯片LED光源在PCB设计时进行组合,两种实现途径决定了LED光源在尺寸、传热性能、可维护性等方面存在较大差异。LED串并联方式直接影响各LED支路的电流均衡性,为了确保各LED串联支路电流一致,文章给出了驱动设计中常用的几种方案。除此之外,还给出了利用普通环氧PCB板进行传热设计的解决方案,达到了与铝基PCB板相同的传热效果。Lamps based on multi-LED combined have being used more and more widely. Such lamps can be manufactured not only by packaging multi-LED in one unit, but also by distributing many packaged LED individual lamps on print circuit board（PCB） directly. The two approaches decide the difference in lamp structure, heat transmission capability, maintenance, and so on. The connection methods of LEDs affect directly the current balance between different LED serials. Several different driver designs are discussed in this paper in order to insure the consistency of different LED serials..Furthermore, one kind of heat transmission scheme based on epoxy print circuit board has experimented, which can achieve the same effect as PCB based on aluminium.

关 键 词：多LED组合 灯具 驱动 传热 

分 类 号：TN312[电子电信—物理电子学]