Sn-Zn钎料Cu接头的界面反应及力学性能  

Interfacial reaction and joint strength of Sn-Zn solder/Cu

作　　者：周健[1,2] 王常亮[1,2] 薛烽[1,2] 

机构地区：[1]东南大学材料科学与工程学院,南京211189 [2]东南大学江苏省先进金属材料高技术研究重点实验室,南京211189

出　　处：《东南大学学报（自然科学版）》2009年第3期615-622,共8页Journal of Southeast University：Natural Science Edition

基　　金：国家教育部博士点基金资助项目(200802861026)

摘　　要：研究了时效对Sn-Zn-Bi-Nd/Cu接头的界面反应和力学性能的影响.实验结果表明:经过150℃下400h时效,反应扩散层中不仅原有的Cu5Zn8反应层厚度增加,在近Cu一侧还形成了Cu6Sn5反应层.此外,实验发现在Cu5Zn8反应层中易形成微裂纹,且裂纹长度随着时效时间的延长而增加.此时Sn-Zn钎料接头的剪切强度低于Sn-Pb钎料接头的剪切强度,断裂形式为贯穿Cu5Zn8反应层的解理断裂.在80℃时效后,Sn-Zn钎料接头的剪切断口位于钎料区,断裂形式为延性断裂,当时效时间达到1 000h,接头的剪切强度与Sn-Pb钎料接头的剪切强度相当.Effects of aging on interfacial reaction and joint strength of Sn-Zn-Bi-Nd/Cu were investigated. Results show that after aging at 150 ℃ for 400 h, besides the Cu5Zn8 intermetallic compound （IMC）, another IMC （Cu6Sn5 ） forms in reaction layer along with Cu substrate. Micro-cracks may appear in the growing CusZn8 layer, and the length of the micro-crack increases with the aging time. Shear strength of the solder/Cu joint is obviously decreased because of the cleavage fracture through the Cu5 Zn8 layer. The ductile fracture of the joint after aging at 80 ℃ occurs in the bulk solder. After aging at 80℃ for 1 000 h, the shear strength of the Sn-Zn solder/Cu joint approaches that of the Sn-Pb solder/Cu joint.

关 键 词：无铅钎料 锡锌合金 扩散 接头 力学性能 

分 类 号：TN604[电子电信—电路与系统]