金刚石颗粒表面镀铜层的控制氧化  

Controlled oxidation of copper coatings on the surfaces of diamond particles

作　　者：童震松[1] 张毓隽[1] 沈卓身[1] 

机构地区：[1]北京科技大学材料科学与工程学院.北京100083

出　　处：《北京科技大学学报》2009年第6期733-738,共6页Journal of University of Science and Technology Beijing

摘　　要：为了改善熔融玻璃对金刚石颗粒的润湿,需要对镀铜金刚石颗粒在一定气氛下进行控制氧化,从而在其表面获得一定厚度的Cu2O层.通过对金刚石颗粒表面镀铜层氧化的热力学计算,确定了在650℃、露点温度为20℃的N2/H2O二元混合气氛中进行氧化.氧化的动力学研究表明,在此条件下金刚石颗粒表面镀铜层的氧化符合抛物线规律,其抛物线速度常数为1.127 5×10-12g2.cm-4.min-1.在动力学研究的基础上,本实验选择氧化时间为40 min.XRD实验结果表明,氧化后的金刚石颗粒表面只有Cu和Cu2O,未生成CuO.In order to improve the wettability of molten glass on diamond particles, copper coatings on the surfaces of diamond particles should be oxidized in certain atmosphere to obtain Cu2O coatings with eertain thickness. Thermodynamic calculations for the oxidation of copper coatings on diamond surfaces were carried out and the oxidation process was determined to be proceeded at 650℃ in N2/H2O atmosphere with a dew point of 20℃. The dynamic research results showed that the oxidation of copper coatings on diamond surfaees followed a parabolic rule and the parabolic rate constant was 1.127 5 ×10^-12g2.cm^-4.min^-1 in this condition. On this base, the oxidation time was chosen as 40 min. XRD results showed that the oxidized copper coatings on the surfaces of diamond partides were only composed of Cu and Cu2O, without any CuO.

关 键 词：金刚石 氧化亚铜 氧化 控制气氛 

分 类 号：TG172.8[金属学及工艺—金属表面处理]