集成电路封装用低温低介陶瓷材料的研制  

The Development of Ceramic Material with Low Sintering Temperature and Low Dielectric Constant for IC Packing

作　　者：储章生 

机构地区：[1]宜兴电子器件总厂,214221

出　　处：《江苏陶瓷》1998年第2期10-11,共2页Jiangsu Ceramics

摘　　要：简要地叙述了国家八五攻关项目“85-705”中“低温低介电常数陶瓷材料”s This paper has briefly described the development process and main technical problems of low dielectric constant ceramics material of the key task “85-705' Subject of the national eighth five-year plan.

关 键 词：集成电路 封装 陶瓷材料 介电陶瓷 

分 类 号：TN405.94[电子电信—微电子学与固体电子学]