钼粉表面化学镀铜复合粉末烧结致密化  

Sintering behavior of Mo/Cu composite powders prepared by electroless copper plating on molybdenum powders

作　　者：王光君[1,2] 王德志[1,2] 周杰[1,2] 吴壮志[1,2] 徐兵[1,2] 

机构地区：[1]中南大学有色金属材料科学与工程教育部重点实验室,湖南长沙410083 [2]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《材料热处理学报》2009年第3期36-41,共6页Transactions of Materials and Heat Treatment

摘　　要：对化学镀法制备铜包钼的钼铜复合粉体的烧结致密化特点进行了研究,讨论了化学镀法制备钼铜复合粉的成形性,分析了化学镀铜钼粉的预处理、烧结温度、保温时间及复压复烧工艺对致密化的影响。结果表明,化学镀法制备钼铜复合粉成形性好,生坯相对密度可达到87%。在优化各影响因素的情况下,Mo/28Cu采用常规粉末冶金工艺得到了相对密度达97%的钼铜复合材料,钼铜复合材料具有典型的网络状结构,复合材料内部基本无孔洞,铜相分布均匀。The characteristics of sintering densification of Mo/Cu composite powders made by electroless plating method was studied. The formability of Mo/Cu composite powders which is copper coated molybdenum powder made by electroless copper plating was discussed, and the influence of powder pretreatment, sintering temperature, soaking time and repressing-resintering on densification of the sintered material was researched. The results indicate that Mo/Cu composite powders have a good forming ability, the relative density of green compact can reach up to 87%. The relative density of Mo/28Cu composite material prepared by conventional powder metallurgy process can reach to 97 % . The Mo/28Cu composite material with typical network structure has few holes and the copper distributes uniformly.

关 键 词：钼粉 化学镀铜 钼铜复合粉体 致密化 

分 类 号：TG146.4[一般工业技术—材料科学与工程] TB331[金属学及工艺—金属材料]