无铅工艺和有铅工艺  

Discussion of Lead-free and Lead Technics

作　　者：邵志和[1] 

机构地区：[1]株洲南车时代电气股份有限公司,湖南株洲412001

出　　处：《电子工艺技术》2009年第4期203-205,209,共4页Electronics Process Technology

摘　　要：随着国际环保要求逐步提高,无铅工艺成为电子产业发展的一个必然过程。详细介绍了有铅工艺和无铅工艺的焊料合金成分、焊料成本、焊料合金熔点温度、焊料合金可焊性、焊焊接后出现的各种故障现象和焊接工艺特点,同时指出了有铅和无铅工艺对电子元器件和PCB要求的不同点,指出了它们的利弊以及使用设备的通用性。With the development of enviromental protection, lead - free process has become an inevitable trend in electronics industry. Introduce the solder alloy, solder cost, soldering temperature, solderability, soldering defects and soldering process characteristic of lead - free and lead technics in details. Point out the different requirements of lead - free and lead technics for components and PCB, give out the advantages and disadvantages of each process and the universal properties of the equipment.

关 键 词：焊接 无铅工艺 表面贴装工艺 

分 类 号：TN605[电子电信—电路与系统]