稀土相表面Sn晶须生长的研究  

Tin whisker growth accelerated by the oxidization of RE-phase on lead-free solder surface

作　　者：郝虎[1] 史耀武[1] 夏志东[1] 雷永平[1] 郭福[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100124

出　　处：《电子元件与材料》2009年第8期35-38,共4页Electronic Components And Materials

基　　金："十一五"国家科技支撑重点资助项目(No.2006BAE03B02)

摘　　要：研究了Sn-3．8Ag-0．7Cu-RE（RE为Ce、Er或Y）焊料在空气中室温与高温时效过程中稀土相CeSn3、ErSn3与YSn3表面Sn晶须的生长情况。结果表明，Sn晶须的开始生长时间、形态及数量与稀土相的种类及时效条件有密切关系。稀土相因氧化产生的体积膨胀提供了Sn晶须生长的驱动力。稀土与氧的化学亲和力参数及时效温度共同影响稀土相表面Sn晶须的生长。室温实效条件下，三种稀土相表面Sn晶须的直径为0．1-2．0μm，长度可达几百微米；150℃时效条件下，Sn晶须的直径为0．1-0．2μm，长度也可达上百微米。Tin whisker growth on the surface of the oxidized CeSn3, ErSn3 and YSn3 phases on lead-free solder surface was investigated with room temperature and 150℃ aging in air, respectively. The results indicate that rapid tin whisker growth is found on the surface of the oxidized RE-phases. Moreover, the starting growth time, morphology and the quantity of tin whisker are dominated by the category of RE-phases and aging temperature. Because the volume expansion caused by the oxidization of RE-phase provides tin whisker growth driving force, thus, the chemical affinity parameter between RE and oxygen and the aging temperature jointly determine the tin whisker growth on the oxidized RE-phase. During room temperature aging, the diameter of tin whiskers changes in the great range （0.1～2.0μm） and the length can reach several hundred microns; During 150℃ aging, the diameter of tin whiskers is small （0.1-0.2μm） and the length can reach one hundred microns.

关 键 词：无铅钎料 稀土 SN晶须 形态 

分 类 号：TN601[电子电信—电路与系统]