微量RE和Al对Sn-9Zn焊料组织与性能的影响  

Effects of trace RE and Al on microstructure and properties of lead-free solder alloy of Sn-9Zn

作　　者：吕娟[1] 赵麦群[1] 王秀春[1] 康晶[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《电子元件与材料》2009年第8期39-42,共4页Electronic Components And Materials

基　　金：陕西省自然科学研究计划资助项目(No.2002E111)

摘　　要：采用正交试验研究了微量RE和Al对Sn-9Zn无铅焊料电导率、硬度、润湿性及微观组织的影响,并与传统锡铅焊料进行了对比。Sn-9Zn焊料的电性能及力学性能优于传统锡铅焊料,但润湿性较差。添加微量RE和Al可以显著提高Sn-9Zn合金铺展率、细化组织,且不降低焊料电导率和力学性能,最佳w(RE)和w(Al)分别为0.05%和0.10%,铺展率达到61.98%,与Sn-9Zn相比提高了13.40%,硬度为20.90HB,电导率为8.15×106S/m。By means of electric conductivity meter, Brinell hardness tester and optical microscope, effects of addition of RE and Al to Sn-9Zn lead-free solder on its conductivity, hardness, wetting property and the microstructure were analyzed through orthogonal experiment. Meanwhile, comparative tests with traditional Sn-Pb solder were studied. The results show that Sn-9Zn solder has better electrical property and mechanical property, but wetting property is worse, compared with traditional Sn-Pb solder. Trace RE and AI elements can significantly improve the spreading ratio and refine microstructure of Sn-9Zn solder, while conductivity and hardness still can be maintained on the original level. The comprehensive properties of solder was optimized by adding w（RE） 0.05% and w（Al） 0.10%; the spreading ratio increases by 13.4% compared to Sn-9Zn and reaches 61.98%, with hardness 20.90 HB and conductivity 8.15×10^6S/m.

关 键 词：无铅焊料 SN-9ZN RE AL 铺展率 微观组织 

分 类 号：TG425.1[金属学及工艺—焊接]