抛光垫在蓝宝石衬底化学机械抛光中的应用研究  

Study the application of pad in chemical mechanical polishing for sapphire wafer

作　　者：周海[1] 王黛萍[1] 王兵[1] 陈西府[1] 冶远祥 

机构地区：[1]盐城工学院,盐城224051 [2]兴化祥盛光电子材料公司,兴化225761

出　　处：《机械设计与制造》2009年第8期88-90,共3页Machinery Design & Manufacture

基　　金：江苏省自然科学基础研究项目(BK2008197);江苏省科技厅科技攻关项目(BE2007077);江苏省高校自然科学基础研究项目(06KJB460119);江苏省大学生实践创新训练计划项目(07SSJCX026)

摘　　要：在分析化学机械抛光中常用抛光垫的材质、性能、表面结构基础上,研究了抛光垫对蓝宝石衬底抛光质量的影响规律:材质硬的抛光垫可提高衬底的平面度;材质软的抛光垫可改善衬底的表面粗糙度;表面开槽的抛光垫可提高抛光效率;表面粗糙的抛光垫可提高抛光效率;对抛光垫进行适当的修整可使抛光垫表面粗糙;用聚氨酯类抛光垫能够使得蓝宝石衬底的抛光面小于0.3nm的表面粗糙度。Based on the analysis on the material,performance,surface structure used in CMP pad, effect has been studied about polishing pads used on polishing the sapphire substrate. The hard polishing pad can improve the substrate flatness. The soft polishing pad can improve the substrate surface roughness. The grooved pad can improve the efficiency of polishing. The rough pad can improve the efficiency of palishing; Conditioning A mending can improve polishing pad surface roughness ;PU type pad can make the roughness of sapphire substrate surface be less than 0.3 nm.

关 键 词：蓝宝石 衬底片 化学机械抛光 抛光垫 

分 类 号：TH161[机械工程—机械制造及自动化] TN205[电子电信—物理电子学]