电路组装中的X射线检测技术  

X-ray Inspection Technology of Electronics Assembly

作　　者：鲜飞[1] 

机构地区：[1]烽火通信科技股份有限公司,湖北武汉430073

出　　处：《中国集成电路》2009年第8期70-73,共4页China lntegrated Circuit

摘　　要：高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战,新的测试技术不断涌现,X射线(X-ray)检测技术就是其中之一,它能有效控制BGA的焊接和组装质量。本文扼要的介绍X射线检测技术的原理及未来发展趋势。The rapid development of high density packaging technology has already bring up the new challenge to testing technology. For replying challenge, the new testing technology continuously appears, X-ray inspection is one of them, it can be used to control quality of BGA soldering and assembly. This paper simply introduces the theory of automatic X-ray inspection, the development of it is also mentioned.

关 键 词：X射线检测 线路板 球栅阵列封装 电路组装 

分 类 号：TN605[电子电信—电路与系统] TP274.51[自动化与计算机技术—检测技术与自动化装置]